YorChip, Digitho launch low-cost UniPack advanced packaging

YorChip and Digitho say their UniPack 2.5D packaging platform is ready for early alpha customer trials, with support for pad pitches down to 35 microns and a path to sub-10-micron pitch by 2028. The companies say the approach could cut advanced packaging costs by eliminating interposers, bridges and substrates.

Why it matters: - UniPack targets a key bottleneck in advanced packaging: cost and supply constraints tied to interposers, bridges and substrates. - The platform could expand heterogeneous integration for chiplets, FPGA dies, passives and IVR dies in a single package. - YorChip and Digitho are positioning the technology for a market Yole Group forecasts will exceed $100 billion by 2031. More information

What happened: - YorChip and Digitho announced UniPack Advanced Packaging on Aug. 12, 2026. - The companies say the 2.5D advanced packaging solution is ready for early alpha customer trials. - UniPack currently supports any pad pitch from 200 microns to 35 microns. - The companies say the roadmap calls for sub-10-micron pitch in the 2028 timeframe. - Availability for early customer validation is immediate, with broad availability expected by mid-2027.

The details: - YorChip says UniPack enables universal packaging and integration of standard and advanced chiplets and other semiconductor devices. - YorChip says passives and IVR die can also be integrated. - YorChip plans initial validation by packaging multiple FPGA die in Q4 of this year. - Digitho says the joint development replaces interposers, bridges and substrates with a dry PID (Photo Imageable Dielectric). - Digitho says the process builds a complete heterogeneous wafer of known good die. - Digitho says support currently reaches 35-micron pitch. - Digitho says its programmable photo mask should enable support below 10-micron pitch. - QuickLogic CEO Brian Faith said the launch could support leading-edge size, weight, area and power improvements for its target markets. - QuickLogic plans to evaluate UniPack for forthcoming high-density FPGA-based silicon solutions.

Between the lines: - The announcement signals a push to make advanced packaging less dependent on specialized, harder-to-source materials and structures. - The pitch appears aimed at customers building high-density, heterogeneous systems where packaging cost and integration complexity can limit adoption. - The early alpha phase suggests the platform still needs customer validation before wider commercialization.

What's next: - YorChip and Digitho will seek early customer trials and validation. - The companies expect broader availability by mid-2027. - The roadmap targets sub-10-micron pitch capability in 2028. - QuickLogic said it will evaluate the platform for upcoming FPGA-based silicon work.

The bottom line: - UniPack is a cost-cutting packaging play aimed at making heterogeneous chip integration simpler, denser and less dependent on scarce packaging components.